MSI NVIDIA GeForce RTX 4060 Ti VENTUS 3X OC 16G GDDR6 Graphics Card
- Boost Clock: 2610MHz (2625 MHz MSI Center)
- CUDA Cores: 4352
- Power Consumption: 165W
- Recommended PSU: 550W
- Dimensions: 308 x 120 x 42 mm
£493.99
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Product Description
Introducing the MSI NVIDIA GeForce RTX 4060 Ti VENTUS 3X OC 16G. Powered by NVIDIA’s Ada Lovelace architecture and 16GB of GDDR6 memory, it delivers superb gaming and creative performance. With triple fan cooling, TORX fan 4.0, precision heat pipes, and zero Frozr technology, it maintains optimal performance.
VENTUS brings a fundamentally solid experience to users looking for a performance graphics card. A sharp-looking updated design with TORX FAN 4.0 and Airflow Control lets VENTUS breeze through any task.
Specifications
- Base Clock: 2310MHz
- Boost Clock: 2610MHz (2625 MHz MSI Center)
- Memory: 16GB 18000MHz GDDR6
- CUDA Cores: 4352
- Power Consumption: 165W
- Recommended PSU: 550W
- Form Factor: 2 Slots
- Dimensions: 308 x 120 x 42 mm
- Ada Lovelace GPU Architecture
- NVIDIA DLSS 3 and full ray tracing
- 4th Generation Tensor Cores
- 3rd Generation Ray Tracing Cores
- Triple Fan Thermal Design
- TORX Fan 4.0
- Airflow Control
- Zero Frozr
2310MHz
Base Clock
2610MHz
Boost Clock
16GB
GDDR6 Memory
4352
CUDA Cores
About the MSI NVIDIA GeForce RTX 4060 Ti VENTUS 3X OC 16G Graphics Card
TORX FAN 4.0
TORX FAN 4.0 is built on teamwork, with pairs of fan blades bound together with a linked outer ring design that focuses airflow into the Triple-Fan cooling system.
Copper Baseplate
Heat from the GPU and memory modules is immediately captured by a solid nickel-plated copper baseplate and then rapidly transferred to an array of heat pipes. This widening of the thermal transfer systems with highly efficient mechanisms improves overall efficiency.
Core Pipes
Core Pipes are precision-crafted to make maximum use of the available space. A squared section of heat pipes fully touch the GPU baseplate to then spread heat along the full length of the heatsink.
Airflow Control
Stay stealthy with Airflow Control which improves airflow dynamics. Deflectors provide additional surface area and guide air to where it’s needed for maximum cooling.
Effective Thermal Padding
An abundance of clay-based thermal pads provide additional heat dissipation for board components.
Metal Backplate
Thermal pads under the sturdy aluminium backplate provide additional cooling while the flow-through ventilation reduces trapped heat.
MSI Center
MSI’s exclusive MSI Center software helps you get the most out of your MSI products. Monitor, tweak, and optimize in real-time with just a few clicks.
Product Specifications
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