The GIGABYTE GTX 1650 4GB WINDFORCE OC cooling system features 2 x 90mm unique blade fans, which spin alternately along with a composite copper heat pipe direct touch GPU and 3D active fan so gamers can also enjoy a quiet system whilst gaming, all while delivering an effective heat dissipation. Powered by the award-winning NVIDIA Turing architecture and ultra-fast GDDR6 memory, it’s a supercharger for today’s most popular games. Time to gear up and get SUPER.
- Base Clock: 1410MHz
- Boost Clock: 1710MHz
- Memory: 4GB 12000 MHz GDDR6
- CUDA Cores: 896
- Recommended PSU: 300W
- Form Factor: 2 Slots
- Dimensions: 191 x 112 x 36 mm
- Powered by GeForce GTX 1650
- NVIDIA Turing architecture and GeForce Experience
- Integrated with 4GB GDDR6 128-bit memory interface
- WINDFORCE 2X Cooling System with alternate spinning fans
- 80 mm unique blade fans
- Protection Back Plate
About the GIGABYTE GTX 1650 4GB WINDFORCE OC Graphics Card
WINDFORCE 2X COOLING SYSTEM
WINDFORCE 2X cooling system features 2 x 80mm unique blade fans, alternate spinning fan, a composite copper heat pipe direct touch the GIGABYTE GTX 1650 4GB WINDFORCE OC GPU and 3D active fan functionality, together delivering an effective heat dissipation capacity for higher performance at lower temperatures.
The GIGABYTE “Alternate Spinning” is the only solution to solve adjacent fans’ turbulent airflow. Since the adjacent fans rotate in the same direction, the airflow direction is opposite between the fans, which will cause turbulent airflow and reduce heat dissipation efficiency. GIGABYTE turns the adjacent fans in the opposite direction so that the airflow direction between the two fans is the same, reducing the turbulence and enhancing the airflow pressure.
UNIQUE BLADE FAN
The airflow is spilt by the triangular fan edge, and guided smoothly through the 3D stripe curve on the fan surface, effectively enhancing the airflow.
HEAT PIPE DIRECT TOUCH
The pure copper heat pipe’s shape maximizes the direct contact area with the GPU, enhancing heat transfer. The heat pipe also covers the VRAM through a large metal plate contact to ensure proper cooling.
The composite heat-pipe combines thermal conductivity and phase transition to efficiently manage the heat transfer between two solid interfaces, which increases cooling capacity.